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材料特點(diǎn)：

1.無(wú)鹵中Tg環(huán)保材料

2.材料Tg≥155。C(DSC), Df≤0.015

3.良好的加工性和抗CAF可靠性.

4.低成本HDI應用.

Material Characteristics

1.Halogen free, Middle Tg

2.Material TG≥155。C (DSC), DF≤0.015

3.Excellent machinability and anti CAF reliability

4.Low cost HDI applications

產(chǎn)品應用：

智能手機、平板電腦、筆記本電腦、消費性電子、Mid-loss服務(wù)器

對等材料:IX-X50G\RXX66W\XM285

Product Application

Smartphones, tablets, laptops, consumer electronics,

Mid loss servers

Equivalent material: IX-<50G\RXX66WXM285